Many products and designs need the combination of Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) in order to provide accurate models. We use multiphysics analysis to simulate multiple physical phenomena to provide accurate models. One example is thermal management. It is often includes a cooling flow. It could be air, water or oil, and its velocity distribution directly impacts the heat transfer rate. Coupling Flow and Heat Transfer analyses into one FEA is a very powerful tool for the simulation of system that have thermal management requirements. Another example is the interaction of fluids and solids. Moving fluids apply momentum forces against the solid walls around them. Predicting these forces is another multi-physics problem that ASR has the software and experience to perform.
Fluid-Structure Interaction (FSI)
When fluids interact with structures they apply stable or oscillatory loads which induce stress on the structure. In order to accurately model this interaction, we use multiphysics. We simultaneously use CFD and FEA to model the fluid loads and structural stress and strain. Multiphysics is required to create accurate computer models of aerodynamic or hydrodynamic loading on solid bodies including structures, aircraft, watercraft, and more.
Many structures in mechanical engineering including turbines, combustion engines, and more are exposed to thermal and structural loads simultaneously. In order to accurately model these scenarios which involve conduction, convection, radiation, and stress we apply multiphysics analysis. This process uses nonlinear analysis to model the combination of thermal and structural strain and stress to determine the total strain and stress which occurs.
Systems with convective flow such as thermal management systems require modeling flow and thermal transfer simultaneously. One example of this is the use of a heat sink for cooling electrical components. We analyze the electrical enclosure to ensure optimal airflow to take advantage of the heat sinks large surface area to induce convection to cool components.
Electrical enclosures, motors, printed circuit boards, and other products experience structural loading from the electromagnetic field required for system operations. The analysis of this loading requires multiphysics analysis to ensure the structure is adequately designed.
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